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TSMC's next generation of system-on-wafer packaging will make today's CPUs and GPUs look pathetically feeble in comparison
TSMC's first generation of SoW packaging involved mounting just the processing dies to the wafer, whereas the new version ...
TweakTown3d
NVIDIA explores CoWoP (Chip-on-Wafer-on-Platform) PCB packaging with next-gen Rubin GR150 GPUs
NVIDIA is considering moving to CoWoP advanced packaging for its next-gen Rubin GPUs: removes substrate, connects interposer ...