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TSMC's next generation of system-on-wafer packaging will make today's CPUs and GPUs look pathetically feeble in comparison

TSMC's first generation of SoW packaging involved mounting just the processing dies to the wafer, whereas the new version ...
TweakTown2d

NVIDIA explores CoWoP (Chip-on-Wafer-on-Platform) PCB packaging with next-gen Rubin GR150 GPUs

NVIDIA is considering moving to CoWoP advanced packaging for its next-gen Rubin GPUs: removes substrate, connects interposer ...
The Mirror1d

How did Ian Brady die? Cause of Moors Murderer’s 'slow' death and ...

News UK News Ian Brady How did Ian Brady die? Cause of Moors Murderer’s 'slow' death and details of inquest Ian Brady died at the age of 79 in 2017. He was England’s longest serving prisoners ...