However, strict growth requirements and complex processes have limited global production to small batches of two- to four-inch N-polar GaN wafers at prohibitive costs – until now. On March 22 ...

One of the biggest challenges is the limited availability of key raw materials like silicon wafers, high-purity gases, specialty chemicals, and ultrapure water, which are essential for chip ...

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...