Abstract: 3D coverage path planning for UAVs is a crucial problem in diverse practical applications. However, existing methods have shown unsatisfactory system simplicity, computation efficiency, and ...
The legislation is part of a $4 billion deal that includes money from HECO, Kamehameha Schools and others. It’s not often that applause breaks out in the audience after a vote at the Hawaiʻi ...
Abstract: This paper presents the key silicon features of Intel’s 3D stacking technology, Foveros, as it is used to enable logic-on-logic die stacking. A robust face-to-face die connection is enabled ...
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