and rapid thermal annealing (RTA), which are integral to transistor formation. In 3D FinFET technology, the poly dummy fill is crucial because the height of the FinFET directly depends on the poly ...

With EUV photolithography technology’s maturity, TSMC is adopting more EUV steps on the N7 platform and rolling out more cost-effective and higher transistor density N6 solutions for mainstream ...

In the ever-dynamic and fast-moving world of semiconductors, why do some old transistors like 2N3904 keep on going for decades? Bill Schweber takes a closer look at this remarkable premise while ...

By eliminating the capacitor, the parasitic capacitance inherent in the read transistor assumes the role of charge storage. This configuration not only simplifies the design but also supports more ...

Maximum transistor density and performance efficiency. Maximum performance efficiency with the best possible power supply at reasonable costs. Multi-chiplet packaging solutions for data centers.

In fact, Intel's implementation matches TSMC's offering in critical interconnect density measurements. On the mature-node side of the operation, Intel Foundry has its first production 16nm tapeout ...

Through thoughtful and innovative design, high-density cities and cities that are quickly densifying need to meet the basic needs of their residents and actively, intentionally promote a higher ...

Apple's iPhone development roadmap runs several years into the future and the company is continually working with suppliers on several successive iPhone models simultaneously, which is why we ...

It offers lower logic density than N3 but with better yields. N3P: An enhanced version of N3E, providing 5% higher performance or 5–10% lower power at the same speed, plus a 4% increase in transistor ...

The company estimates a 10% to 15% performance improvement with a 25% to 30% reduction in power consumption, in addition to a 15% increase in transistor density. These figures are compared to the ...