These are the most-read DIGITIMES Asia stories from the week of September 1–September 7. Rapidus 2nm chip matches TSMC's logic density, outpaces Intel in performance Rapidus is racing ahead in the ...

If the Charleston region is going to grow in future years as most of us want it to — in a connected, attractive manner along existing roads rather than into our cultural sites and natural landscapes — ...

Apple has ordered almost half of TSMC's initial 2nm production capacity for the iPhone 18 as the pure foundry begins mass production of its next-generation chip process. According to DigiTimes, TSMC's ...

For decades, fuel cell innovation has been guided by two main benchmarks: cost per kilowatt and stack durability. These remain important, especially in applications driven almost entirely by project ...

Hunter Bennett does not work for, consult, own shares in or receive funding from any company or organization that would benefit from this article, and has disclosed no relevant affiliations beyond ...

You may have heard high-impact activity—exercise such as running, jumping, football and basketball—is good at building bone density and strength. But what about when you're standing still, lifting ...

Ising machines demonstrate significant potential to tackle computationally complex challenges, including combinatorial optimization problems related to logistics, manufacturing, finance, and AI. The ...

The shift to Generative AI (GenAI) has overwhelmed existing infrastructure, transforming previously rare issues into daily operational realities. Skyrocketing costs, intense energy consumption, and ...

Huawei is still a couple of generations behind in terms of performance (on its smartphones) after losing access to its primary chip supplier, TSMC. The brand turned to China’s SMIC for its latest ...

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There are few better windows onto the intense debates raging over densification than Vancouver, Canada. Like in many cities undergoing an unprecedented increase in density, residents and leaders ...

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...