A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics.

A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at Huawei’s HiSilicon, raising alarm over tech IP leaks to China.

While the leaked data involves hybrid bonding technology, an SK Hynix spokesperson clarified that the compromised materials were related to wafer-to-wafer bonding, rather than the HBM-specific ...

Communion wafer thought to be a ‘miracle’ actually just covered in bacteria, lab analysis says By . Associated Press. Published March 27, 2025, 10:05 a.m. ET. MORRIS, Ind.

Bonding Over Books and Long Car Rides Shannon Wu and John Sanders attended the same book festival in Washington, but didn’t meet until they connected on a dating app. Listen to this article · 4 ...

The Reddit user who shared the pictures, AVX512-VNNI, claims to have found the wafer near TSMC's Fab 16 factory in Nanjing, China. While not cutting-edge, that fab ...

imec, a Belgium-based research and innovation hub in nanoelectronics and digital technologies, has announced “a significant milestone in silicon photonics” with the successful demonstration of ...

Gorchichko et al., “Novel Low Thermal Budget Bonding Using Single Wafer Thermal Processing System, Resulting in Excellent Wafer-to-Wafer Hybrid Bonding at sub-0.5um Pitch,” 2024 IEEE 74th Electronic ...

It vertically links die-to-wafer or wafer-to-wafer via closely spaced copper pads, bonding the dielectric and metal bond pads simultaneously in a single bonding step. However, the enhanced reliability ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...