ConspectusPhotovoltaics (PVs) are currently the most economical and location-independent source of electricity generation, and their demand is growing rapidly as a sustainable renewable energy source.

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Infinitesima announces a three-year development project with partners including ASML. The Metron3D 300mm in-line wafer metrology system will be used to optimise and explore metrology solutions for ...

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

As semiconductor devices continue advancing into more sophisticated packaging schemes, traditional optical inspection technologies are brushing up against physical and computational boundaries. The ...

A new technical paper titled “Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, TEL, SK hynix, and University of ...

The 3D hybrid bonding stacking of the XCDs atop the IODs means that there is a lot more bandwidth vertically linking the chips than would be possible using 2.5D interposer techniques, which makes the ...

Stacking dies—going 3D—adds another level to the hierarchy: direct connections between dies, through-silicon vias, and microbumps or hybrid bonding. This level is better than interposer connections, ...

By embedding ITEN’s high-performance solid-state batteries at the wafer level, ITEN and A*STAR IME have successfully demonstrated integrating non-volatile energy storage directly using advanced ...