What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

“The Cadence 3D-IC flow with the Integrity 3D-IC platform is optimized for use on UMC’s hybrid bonding technologies, providing customers with a comprehensive design, verification and ...

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter ...

There are currently three ways of Cu-Cu hybrid bonding (see the benchmarking table below). Wafer to Wafer (W2W) process is the most commonly used, whereas die-to-wafer (D2W) or chip to wafer (C2W) ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...

Wafer thinning, temporary bonding, thin wafer processing, and debonding methods are becoming essential process steps in 2.5D and 3D packaging, wafer stacking, and wafer-level fan-out packaging.

With heterogeneous integration technology constantly evolving, EVG sheds lights on hybrid bonding and NIL trends Janet Kang, Taipei; Willis Ke, DIGITIMES Asia Monday 11 September 2023 0 ...

HSINCHU, Taiwan& SAN JOSE, Calif.---- United Microelectronics Corporation, a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence ® 3 D-IC ...

Adeia Inc., a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and media technology sectors to market, was awarded ...

Using UMC’s 40nm low power process as a wafer-on-wafer stacking demonstration, the two companies collaborated to validate key 3D-IC features in this design flow, including system planning and ...