An Agentic Approach for SoC Security Verification using Large Language Models” was published by researchers at University of ...

D-IC trends and challenges; virtual prototypes for SDVs; chiplet security; sustainable AI development; quality best practices ...

Creating high-quality and high-performance autonomous and connected vehicles while mitigating safety risks across their ...

A new technical paper titled “Practical Guidance on Selecting Analytical Methods for PFAS in Semiconductor Manufacturing ...

Researchers from the University of Massachusetts Amherst created silicon-based in-sensor visual processing arrays that can ...

A new technical paper titled “Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes” was published by ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

A new technical paper titled “Integrated phononic waveguide on thin-film lithium niobate on diamond” was published by ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

A new technical paper titled “Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing” was ...

A new technical paper titled “Machine Intelligence on Wireless Edge Networks” was published by researchers at MIT and Duke ...

IC, AI global ranking; China's fully automated IC design system; Micron goes bigger; PCIe 7.0 spec; TSMC-Tokyo joint lab; ...