School of Chemistry and Biochemistry, Georgia Institute of Technology, Atlanta, Georgia 30332, United States ...
Maintaining seamless server operation is not only essential but also crucial for companies in different sectors like healthcare, law, finance, government offices, and others. Pulseway steps in with an ...
We all know that Arm Cortex-A are application cores, Cortex-M microcontroller-class cores, and Cortex-R real-time cores used in various applications from IoT to automotive or architecture. But this ...
SK Hynix has completed customer validation for its 96GB Compute Express Link (CXL) Memory Module, a DRAM solution that has attracted significant industry attention for its potential to enhance data ...
The IT infrastructure market is undergoing its own kind of climate change thanks to the overheating of the market due to the GenAI boom. Just like real climate change makes it difficult for the ...
PICMG’s COM-HPC open form-factor standard helps developers build high-performance IoT and edge systems with flexibility and efficiency. Addressing applications that require high performance and ...
Common corn rust and southern corn rust, two typical maize diseases during growth stages, require accurate differentiation to understand their occurrence patterns and pathogenic risks. To address this ...
UPDATE (November 12 th, 2024): We clarified the information in the fourth paragraph to better reflect RedLine's functionality before versus after the takedown. Back in April 2023, ESET participated in ...
CISA is warning organizations that two Oracle vulnerabilities tracked as CVE-2022-21445 and CVE-2020-14644 are being exploited in the wild. CISA this week added several vulnerabilities to its Known ...
Abstract: In a smart home environment, multiple users can access a single smart device simultaneously. Moreover, these multiple users may have conflicting demands at a time; that is, one user’s ...
Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field.
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