ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced ...

Wafer thinning, temporary bonding, thin wafer processing, and debonding methods are becoming essential process steps in 2.5D and 3D packaging, wafer stacking, and wafer-level fan-out packaging.

The single-wafer processing market continues to expand ... which is critical for subsequent processing steps.” The Ospray is an extremely flexible system that delivers superior uniformity ...

ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced ...

Wafer processing includes steps such as etching, deposition, lithography, and inspection, all of which require high-precision equipment to ensure the accuracy and functionality of the final ...

Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices and their wiring. They expect the semiconductor ...

The die processing together with a high-accuracy ... Benefitting from the accurate die-to-wafer alignment, low optical coupling losses of below 0.5dB were obtained. In the next steps, we will expand ...

The fragility of ultra-thin wafers demands materials that provide robust mechanical support while remaining inert to subsequent processing steps. Temporary bonding materials help maintain wafer ...