The chucks developed and manufactured by Berliner Glas already have been made as resistant as possible to particle contamination by using a special pin or mesa design. The contact area between the ...

Instead of a conventional wafer chuck, which can damage the front side ... undercut width control on the wafer device side edge and pin mark-free control. The unit can be customized for high ...

With these modes, the AC3 Fusion thermal chuck system is a no-compromise solution for energy-efficient and flexible tri-temperature wafer test. ERS's AC3 with patented air-management technology ...

To supply signals and power to the DUT, a metal-to-metal contact needs to be made between the DUTs pads/pin and interface hardware. For wafer test (sort or probe), this interface hardware is called a ...

Enables adsorptive immobilization with a high extraction rate without deforming thin, sub-50μm semiconductor wafer or film Makes ... called the Hot Vacuum Chuck, or HoVaC for short.

“Global Semiconductor Electrostatic Chuck Market Research Report 2024-2032 ... Tokyo Electron announced the launch of Ulucus™ G, a wafer thinning system for 300 mm wafer fabrication.

High Power Dissipation” is the newest thermal chuck system from ERS electronic, suited for wafer test of complex processors and DRAM and NAND devices. During temperature wafer probing of complex ...

In previous test infrastructures, a high site count was constrained by the available probe pins on the signal tower for wafer testing. However, the proposed signal tower addresses this bottleneck by ...