Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

Arteris recently announced the expansion of its multi-die IP solution. The new upgrades to the company’s network-on-chip (NoC) IP library include the FlexNoC Network-on-Chip with CodaCache Last-Level ...

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Of course, an easier solution might just be to wire up the whole wafer as a single chip and side step the whole slicing malarkey. That's actually a thing and it's called 'wafer-scale' computing.

Inch Wafer Foundry Market is Segmented by Type (Cutting-Edge (3/5/7nm), 10/14/16/20/28nm, 40/45/65/90nm), by Application (Advanced Logic Technology ...

SK hynix supplies 'early' HBM4 memory samples, qualification tests taking longer than HBM3E as its next-gen HBM4 memory is ...

The wafer process control equipment market is being propelled by a combination of these factors, as the industry aims to increase production yields, enhance chip quality, and progress technologically.

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...

Of course, an easier solution might just be to wire up the whole wafer as a single chip and side step the whole slicing malarkey. That's actually a thing and it's called 'wafer-scale' computing.