N.C.), introduced an “engineered substrate” material last week for use in surface-acoustic-wave (SAW) filters. But the new material is just the beginning for the company. Ziptronix sees its ...

The wave guides need a much higher level of control of the silicon ... These include <100nm alignment accuracy, new levels of cleanliness in chip-to-wafer bonding and singulation tools, exceptional ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

Imec, Brewer Science, and Suss MicroTec recently demonstrated that collective die-to-wafer bonding flows can be extended to three and four wafers. [1] A so-called acoustic layer was added to the ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...

Imec and EVG have demonstrated 1.8µm pitch overlay accuracy for wafer-to-wafer bonding. Wafer-to-wafer bonding is a promising technique for enabling high-density integration of future ICs through 3D ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

Semiconductor research lab Imec has demonstrated wafer-bonding with 400nm pitch copper conductors across the boundary, proposing the technology for logic-on-logic and memory-on-logic wafer stacking ...

Pure Wafer, a San Jose-based semiconductor supplier, is planning to triple capacity of its production site in Prescott after closing a private equity deal. Here's what we know. Semiconductor ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...