The temporary bonding and debonding equipment uses a hybrid laser debonding solution with an industry-leading throughput of over 60 to 100 wafers per hour. It also supports wafer thinning to less than ...

A new technical paper titled “Assessment of wafer-level transfer techniques of graphene with respect to semiconductor industry requirements” was published by researchers at RWTH Aachen University, AMO ...

The companies said they will utilize their respective expertise to develop low-temperature wafer bonding equipment and processes. EVG said it brings its 15-years of experience in low temperature and ...

For [emach1ne], the DIY LED was part of a Master’s degree course and began with a slice of epitaxial wafer that goes through cleaning, annealing, and acid etching steps in preparation for ...

A new technical paper titled “Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, TEL, SK hynix, and University of ...

“We continue to see growing adoption of our laser annealing platform for new applications as demonstrated by today’s announcement,” commented Adrian Devasahayam, Ph.D., Veeco’s Senior Vice ...

The semi-automated SB6/8 Gen2 is SUSS MicroTec's state of the art universal permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes.

Wafer bonding is rapidly establishing itself as a pervasive technology in semiconductor manufacturing today. Wafer bonders to review, compare and request for quotes.

--ACM Research, Inc., a leading supplier of wafer cleaning technologies for advanced semiconductor devices, today announced that it has delivered an Ultra C SAPS II tool for R&D to a leading ...

Veeco’s Laser Annealing portfolio also includes its NSA500 system, which extends annealing capabilities to low thermal budget applications, like Backside Power Delivery and Contact Annealing for ...