The global UV tapes market is set for significant growth, projected to rise from USD 661.1 million in 2025 to USD 1,494.5 ...

South Korea's Hanmi Semiconductor is reportedly planning to invest KRW100 billion (US$71.4 million) in hybrid bonding technology, with commercial equipment targeted for release by the end of 2027.

A group led by Cambridge University has developed an adhesive-free method of bonding ultra-thin gallium arsenide solar cells to borosilicate glass. The proposed technique is reportedly compatible with ...

Sandisk has appointed two leading figures in computing to help shape the direction of its high-capacity memory tech for AI ...

The GaN micro-LED market is gaining momentum as next-generation display applications demand superior performance in ...

As part of this project, Infinitesima will be siting a tool at imec, a world-leading research and innovation hub in ...

Infinitesima has announced a three-year development project with partners including ASML. The Metron3D 300mm in-line wafer metrology system will be used to optimise and explore metrology solutions for ...

KIOXIA Europe has expanded its high-capacity KIOXIA LC9 Series enterprise SSD lineup by introducing the industry's first 245.76TB NVMe SSD in 2.5-inch and Enterprise and Datacenter Standard Form ...

AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Q2-25 Revenue and Net Income of € 148.1 Million and € 32.1 Million, Respectively H1-25 Revenue and Net Income of € 292.2 Million and € 63.6 Million, Respectively DUIVEN, the Netherlands, July 24, 2025 ...

Sandisk Corporation (NASDAQ: SNDK) today announced the formation of a Technical Advisory Board to guide the development and strategy of its groundbreaking High Bandwidth Flash (HBF™) memory technology ...