Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Sandisk has appointed two leading figures in computing to help shape the direction of its high-capacity memory tech for AI ...

CEA-Leti has developed an innovative superconducting interconnect brick that could enable achieving a higher density of ...

Infinitesima is pleased to announce a three-year development project with partners including ASML. The Metron3D 300 mm in-line wafer metrology system will be used to optimise and explore metrology ...

Hybrid bonding used thermocompression bonding at 300°C (1.06 MPa), followed by carrier wafer debonding by UV laser. The polymer properties of low modulus, high thermal stability and low moisture ...

Sandisk Corporation (NASDAQ: SNDK) today announced the formation of a Technical Advisory Board to guide the development and strategy of its groundbreaking High Bandwidth Flash (HBF™) memory technology ...

Infinitesima, a developer of advanced RPM technology for the semiconductor industry, has announced a 3 year project.

A new IEEE study investigates how scaling the size of laser arrays has strong implications for self-heating and optical ...

This technology requires process technology to directly bond different chips at the semiconductor wafer stage. HANMI Semiconductor plans to combine TES's plasma, thin film deposition, and cleaning ...

Researchers at the Jülich Research Center and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a ...