What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Sandisk has appointed two leading figures in computing to help shape the direction of its high-capacity memory tech for AI ...

Infinitesima is pleased to announce a three-year development project with partners including ASML. The Metron3D 300 mm in-line wafer metrology system will be used to optimise and explore metrology ...

Sandisk Corporation (NASDAQ: SNDK) today announced the formation of a Technical Advisory Board to guide the development and strategy of its groundbreaking High Bandwidth Flash (HBF™) memory technology ...

Infinitesima, a developer of advanced RPM technology for the semiconductor industry, has announced a 3 year project.

Kioxia is shipping samples of 512Gbit triple-level cell flash memory built with its ninth generation 3D technology, with mass production to follow this ...

A new IEEE study investigates how scaling the size of laser arrays has strong implications for self-heating and optical ...

This technology requires process technology to directly bond different chips at the semiconductor wafer stage. HANMI Semiconductor plans to combine TES's plasma, thin film deposition, and cleaning ...

AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory ...

Part of Kioxia's LC9 series of enterprise SSDs, the new drive offers 245.76TB of capacity by stacking 32 2Tb QLC 3D flash ...

KIOXIA unveils first 245.76 TB NVMe SSD in 2.5-inch and Enterprise and Datacentre Standard Form Factor (EDSFF) E3.L.