Arasan Chip Systems, Inc. ("Arasan"), a leading provider of Total Semiconductor IP Solutions, announced that it has been developing the Universal Flash Storage (UFS) IP core, a next generation ...

Measuring just 9×13mm in dimension, it is an incredibly compact UFS 4.0 chip. The semiconductor company is currently sampling the new solution. Micron promises faster AI performance with its ...

Arasan, the leading provider of IP Cores for the JEDEC UFS and eMMC standards, announces Host Controller Total IP Solutions for the latest UFS standard 2.1 San Jose, CA October 8, 2015 -- Arasan ...

US-based memory chipmaker Micron Technology commenced sample shipments of a Universal Flash Storage (UFS) 4.0 chip expected to appear in flagship smartphones and other devices later this year. Chris ...

It relies on a pair of tiny prisms to bounce light under one side of a BGA chip and back up the other. The prisms are made from thin sheets of acrylic; [Petteri] didn’t have any 1-mm acrylic ...

It was also an odd choice by Google to use the slower eMMC 5.1 NAND on the Pixel 3a since almost all mid-range smartphones launched in 2019 made use of the faster UFS 2.1 storage chip. Thankfully ...

South Korean tech giant Samsung Electronics has initiated the mass production of UFS 3.1 storage chips for automotive applications, specifically targeting in-vehicle infotainment (IVI) systems.

Micron starts building semiconductor plant in India Samsung unveils Automotive UFS 3.1 - faster and with 33% lower power usage Micron unveils its UFS 4.0 storage tech, it's twice as fast as ...

The temperature is controlled via USB by a computer, allowing [Edmar] to set a temperature profile as recommended by the BGA chip’s data sheet. Right now, removing a BGA chip works great ...

Now it appears this chip will indeed be a big one, as newly unearthed details show it will use a BGA package that is 70% larger than the one required by existing Phoenix and Strix mobile CPUs.