In a bold challenge to silicon s long-held dominance in electronics, Penn State researchers have built the world s first working CMOS computer entirely from atom-thin 2D materials. Using ...

imec has presented a tungsten (W) buried power rail (BPR) integration scheme in a FinFET CMOS test vehicle, which does not impact the CMOS device characteristics.

Although semiconductor manufacturing of nanophotonics in Silicon Photonic foundries is maturing, realizing active nanophotonics in the ubiquitous bulk CMOS processes remains challenging. We introduce ...

CEA-Leti at IEDM 2023 today described the world's-first 3D sequential integration (3DSI) of CMOS over CMOS with advanced metal line levels, which brings 3DSI with intermediate BEOL closer to ...

Imec has shown a tungsten (W) buried power rail (BPR) integration scheme in a FinFET CMOS test vehicle, which does not adversely impact the CMOS device characteristics. When interfacing the BPR with ...

CMOS-embedded STT-MRAM Arrays in 2x nm Nodes for GP-MCU applicationA look at array performance and key parameters to meet standard CMOS BEOL requirements.