News

New $123m advanced facility launched, gives local semiconductor firms a leg-up
The facility, located in one-north, is slated to start commercial services in mid-2026. Read more at straitstimes.com. Read more at straitstimes.com.
Design And Reuse23h
2.5D/3D chip technology to advance semiconductor packaging
A team of researchers from the Institute of Science Tokyo (Science Tokyo), Japan, has conceptualised an innovative 2.5D/3D chip integration approach called BBCube.