One issue with the adoption of TSVs in 3D ICs in mainstream semiconductor applications revolves around the throughput of the temporary wafer bonding and debonding process. This doesn’t necessarily ...

The 3M Wafer Support System includes equipment and materials that allow for temporary wafer bonding to support wafer thinning and subsequent processing of ultra thin wafers for 3D packaging. 3M’s ...

hereinafter "Resonac") has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process ...

Temporary Bonding Essential for Heterogeneous Integration Applications Temporary wafer bonding is a widely used method to ensure the processing of thin wafers (under 100-micron silicon thickness ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...