The Trump administration launched a trade probe into semiconductors that could lead to tariffs and broaden an already sweeping trade war. The Commerce Department is looking at how the importing of ...

Ms Khames also fears government plans to change who qualifies for for Personal Independence Payments (PIP) and to reduce Disability Living Allowance for children could affect her. Slough Borough ...

TSMC recently announced that it plans to invest $100 billion to boost chip production in the US. As TSMC aims to be in line with President Trump’s goal of increasing domestic manufacturing, it ...

TSMC today held a 2 nanometer (2nm) capacity expansion ceremony at the construction site of Fab 22 in the Southern Taiwan Science Park (STSP), bringing together representatives from government as well ...

TSMC held a capacity expansion ceremony for its 2-nanometer chip technology at the Fab 22 facility in Kaohsiung on March 31, 2025, marking a critical step in the company's advanced chipmaking ...

TAIPEI -- Leading chipmakers and packagers including Taiwan Semiconductor Manufacturing Co. and Intel have slowed the pace of their expansions in Japan and Malaysia due to lackluster demand for ...

His comments come less than a month after the White House hailed the investment from TSMC, the world’s largest chip manufacturer, as an important milestone in efforts to bring production of the ...

Chancellor Rachel Reeves today announced further welfare cuts as she confirmed changes for personal independence payment (Pip) and Universal Credit. The Office for Budget Responsibility found ...

The government had already announced that changes to a key disability benefit called personal independence payment (Pip) and universal credit (UC) would save around £5bn a year by the end of 2030 ...

In a joint announcement with the US this month, TSMC said it will invest at least another $100 billion in the US over the next few years to build state-of-the-art semiconductor manufacturing ...

IGMTLSY01A is a synchronous LVTLL / LVT / ULVT periphery high-density ternary content addressable memory (TCAM) with column redundancy feature. It is developed with TSMC 5nm 0.75V/1.2V CMOS ...

Foundry Sponsored, TSMC 55 uLP, Sesame 9T, a unique architecture based on 9-track cells, optimized for High Density and Low Dynamic Power allowing users to create faster SoC than with 7-track ...