Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes. Solder balls are small, spherical metallic balls that can form on circuit boards, typically around the ...

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This article is brought to you by our exclusive subscriber partnership with our sister title USA Today, and has been written by our American colleagues. It does not necessarily reflect the view of The ...

EcoClaim™ offers a streamlined approach to managing waste streams such as solder dross, metals, e-waste, and used containers, including plastics, helping companies meet their sustainability goals ...

Abstract: Solder joint thermal fatigue failure is a major concern for area array technologies such as flip chip and ball grid array technologies. Solder joint geometry is an important factor ...

Abstract: Thermomigration behaviors of Cu atoms in both ternary Sn-Bi-In solder and commercial Sn-Cuo.7 solder are investigated respectively at the reflow state to reveal the effect of sluggish ...