At last year’s IEDM, imec reported a breakthrough in the hetero-integration of InP chiplets on a 300mm RF Si interposer – at frequencies up to 140GHz. Now, at ECTC 2025, imec announces a new milestone ...

MmWave (30-100GHz) and sub-THz (100-300GHz) bands are seen as the future for next-generation RF systems including wireless ...

At last year’s IEDM, imec reported a breakthrough in the hetero-integration of InP chiplets on a 300mm RF Si interposer, at ...

These improvements in characteristics indicate that CMP of the SiGe substrate is a critical technique for developing high-performance strained-Si CMOS.