A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by Advanced Interconnect Technologies (AIT) meets today's OEM requirements of MSL Level 1, 260°C standards.

Operating from 50-Hz to 7-MHz received frequencies, the MSRFIF RF-interface front-end IC runs at 5-kbps upconverting and 120-kbps downconverting data rates. The device suits remote medical sensing, ...

0 comments on “ New technology seen stabilizing IC package sector ” Leave a Reply You must Sign in or Register to post a comment.

Display Driver IC Market Research Report by Display Technology (LCD and LED), by IC Package Type (BGA, FLGA, and LGA), by Application, by End Use, by Region (Americas, Asia-Pacific, and Europe ...

[Pyra] was looking for a way to reprogram some ATtiny13 microcontrollers in a SOIC package. He’s re-engineering some consumer electronics so adding an ISP header to the design isn’t an option ...

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...

The Virtuoso System Design Platform allows IC designers to easily include system-level layout parasitics in the IC verification flow, enabling time savings by combining package/board layout ...

An integrated DrMOS solution from Vishay is said to provide high side and low side n-channel mosfets plus a full featured mosfet driver ic in a single PowerPAK MLF6x6 package.

China’s IC packaging and testing industry is more mature than its IC manufacturing and design sectors, reckons SEMI, though IC packaging and testing revenue growth has slowed in recent years.

TI is trying to transform the tightly wound cylindrical coils and mechanical switches of traditional relays into components that can fit inside a standard IC package.