Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing need for silicon that can power consumer Macs and ...

[Pyra] was looking for a way to reprogram some ATtiny13 microcontrollers in a SOIC package. He’s re-engineering some consumer electronics so adding an ISP header to the design isn’t an option.

The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with the new M5 chips to enhance AI capabilities in consumer devices and cloud services. Apple has ...

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Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip (SoIC) technologies focused by AP6 can be flexibly... Save my User ID and Password Some ...