Abstract: A brand new 3D integrated circuit (3DIC) solution, System on Integrated Chips (SoIC™), has been successfully developed to integrate active and passive chips into a new integrated SoC system ...

Apple manufacturing partner TSMC plans to use a more advanced (System on Integrated Chip) SoIC packaging technology for the M5 chips. SoIC technology allows for the stacking of chips in a 3D ...

To further optimize the performance of its chiplet-based GPUs, Nvidia will also leverage TSMC’s advanced packaging technologies, including SoIC (System-on-Integrated Chip). This technology ...

Suchi is planning to start with assembling and testing basic small outline integrated circuit (SOIC) chips for consumer electronics such as televisions, computers, and air conditioners.

TSMC’s process for the M5 will reportedly involve the company’s System on Integrated Chip (SoIC) technology, which enables chip components to be stacked on top of each other in a three-dimensi ...

A new optical computing era TSMC’s approach involves integrating CPO modules with advanced packaging technologies such as chip-on-wafer-on-substrate (CoWoS) or small outline integrated circuit (SOIC).

Increasingly, scientific breakthroughs will be powered by advanced computing capabilities that help researchers manipulate and explore massive datasets. The speed at which any given scientific ...

Apple analyst Ming-Chi Kuo says that for the M5 Pro chip, Apple will be taking advantage of TSMC’s very latest chip packaging process known as SoIC-mH (System-on-Integrated-Chips-Molding ...

The big news is that according to Kuo, the M5 Pro, M5 Max, and M5 Ultra will use TSMC's new packaging for those chips which is known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal). This ...

The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with the new M5 chips to enhance AI capabilities in consumer devices and cloud services. Apple has ...

In this 2018 book, two microchips named SOIC and SOT embark on a quest to discover their purpose, journeying from a warehouse through an electronic assembly line and out into the world.