Apple moves away from using TSMC's new 2nm process node for its next-gen M5 chip because of high costs, will use SoIC technology, expected in 2025.

In a report from DigiTimes, we're learning that Apple would adopt TSMC's new SoIC (System on Integrated Chip) advanced packaging technology that allows for 3D stacking of chips, providing improved ...

He calls the system SOICbite. The SOIC clip attaches to a footprint consisting of eight pads, four on each side of the PCB, plus five non-plated-through holes, which serve to anchor the clip in place.

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HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced ...