InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F) SoIC technology ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP on TSMC's N5 ...

HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced ...

Apple is developing many new M5 and M6 Mac configurations, and we now have exclusive details on exactly what the company is developing.

Fully-Depleted (FD) Silicon-on-Insulator (SOI) has become very attractive for deep submicron CMOS applications because of its quasi-ideal properties. Scaling FD SOI involves, amongst many other ...

InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration Tuesday, July 15, 2025 Niobium Superconducting Interconnects ...

This paper compares the merits of different "multiple-gate" SOI MOSFET structures in terms of short-channel effects and current drive. It is found that, in general, the higher the number of gates, the ...

微信公众号开发API封装. Contribute to rosbit/go-wx-api development by creating an account on GitHub.

A Curated list of Security Resources for all connected things - V33RU/awesome-connected-things-sec ...