This study reports the first ever 3-wafer-stacked CMOS image sensor comprising an artificial intelligence (AI) chip with a deep neural network (DNN)-based circuit. The sensor was fabricated by bonding ...

Herein, a high-resolution guided up-sampling (HRGU)-based semantic segmentation network is demonstrated for high-accuracy wafer surface defect inspection. First, a novel HRGU block is developed to ...

The structural design of the microsensor and the principle of volume compressed sensing. a The resonant high pressure microsensor comprises a SOI wafer with resonators and vias, and a silicon ...

SOITEC REPORTS FIRST QUARTER REVENUE OF FISCAL YEAR 2026 Q1’26 revenue: €92m, down 16% year-on-year on an organic1 basis, slightly better than the guidance Q1’26 year-on-year revenue development ...