The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties cannot be ...

To meet this challenge, researchers at MIT have unveiled a promising new approach that could redefine how we build ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

This incredible Creamsicle Fruit Dip With Fluff is one of my favorite quick and delicious dip recipes. This dip’s fluffy and smooth texture with a fruity flavor will surely be a hit with anyone who ...

Investing.com -- Baird Equity Research upgraded STMicroelectronics N.V. EPA: STMPA) to “outperform” and raised its price ...

Oreo Fans Are Calling Its New Limited-Edition Release a 'Game Changer' originally appeared on Parade. Oreo fans have ...

Continued innovation is helping to drive the development and growing adoption of wide bandgap materials, such as GaN.

TSMC has won an “almost unbeatable” position in the semiconductor industry, says Malcolm Penn (pictured)  CEO of  Future ...

Deal Semiconductor has started shipping its first silicon devices based on a new architecture called SuperQ with lower losses ...

The SiC MOSFETs benefit from improvements to the component structure, based on the original double-trench design. Therefore, it achieves up to 40% lower on-resistance with notably higher robustness ...

FTIR spectroscopy and digital twin simulations enhance thin-film deposition in semiconductor manufacturing, ensuring ...

Renesas launches the Gen IV Plus platform with three new high-voltage 650-V GaN FETs for AI data centers and server power ...