A key advantage of SiC wafers for GaN chips is the high thermal conductivity, which is a major aid to heat management and ...

Jiadi Zhu, CEO & Co-Founder of MIT start-up CDimension, discusses the opportunity for molybdenum disulfide to advance the ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

This incredible Creamsicle Fruit Dip With Fluff is one of my favorite quick and delicious dip recipes. This dip’s fluffy and smooth texture with a fruity flavor will surely be a hit with anyone who ...

Oreo Fans Are Calling Its New Limited-Edition Release a 'Game Changer' originally appeared on Parade. Oreo fans have ...

Continued innovation is helping to drive the development and growing adoption of wide bandgap materials, such as GaN.

TSMC has won an “almost unbeatable” position in the semiconductor industry, says Malcolm Penn (pictured)  CEO of  Future ...

This article investigates the recoverable (and temperature dependent) current lowering induced by negative backgating in buffer-free GaN-on-SiC devices. Remarkably, we demonstrate that such an effect ...

Deal Semiconductor has started shipping its first silicon devices based on a new architecture called SuperQ with lower losses ...

The SiC MOSFETs benefit from improvements to the component structure, based on the original double-trench design. Therefore, it achieves up to 40% lower on-resistance with notably higher robustness ...

FTIR spectroscopy and digital twin simulations enhance thin-film deposition in semiconductor manufacturing, ensuring ...

Renesas launches the Gen IV Plus platform with three new high-voltage 650-V GaN FETs for AI data centers and server power ...