A Chinese tech firm in Wuhan, Hubei province, has achieved a breakthrough in mass-producing silicon carbide (SiC) wafers at ...

This latest triumph builds on previous successes by the Japanese company, which has shown that quartz-free HVPE can grow GaN layers with record room-temperature mobilities. Epilayers also feature very ...

A key advantage of SiC wafers for GaN chips is the high thermal conductivity, which is a major aid to heat management and ...

Ten years ago, Cardiff University got the go-ahead for the establishment of a 'Research Institute for Compound Semiconductor ...

The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties cannot be ...

To meet this challenge, researchers at MIT have unveiled a promising new approach that could redefine how we build ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

This incredible Creamsicle Fruit Dip With Fluff is one of my favorite quick and delicious dip recipes. This dip’s fluffy and smooth texture with a fruity flavor will surely be a hit with anyone who ...