Fine-pitch wafer-to-wafer hybrid bonding is pivotal for advancing semiconductor integration and requires high overlay accuracy to ensure device performance and ...

Hybrid bonding is being evaluated for advanced packaging of 2.5 and 3D modules due to the enhanced scalability and performance (thermal, electrical and reliability) of the interconnect. The direct ...

Using only a single-crystal piezoelectric thin wafer of lithium niobate (LN) instead of the usual two-part structure, a group from Nagoya University in Japan has created a deformable mirror that ...

The interest in the wafer-scale growth of two-dimensional (2D) materials, including transition metal dichalcogenides (TMDCs), has been rising for transitioning from lab-scale devices to ...

SkyWater's $1B Fab-25 deal aims to boost Wafer Services revenues, scale chip output and expand U.S. foundry capacity.

Just 30 minutes from Johor Bahru lies Kulai, a charming little town filled with delicious eats, cheap stays, scenic hikes, and surprisingly good shopping.

The partners have agreed on a six-month detailed roadmap to build the foundations of a groundbreaking innovation for the semiconductor industry. The solution aims to significantly improve wafer ...

Wafer-scale technology is making waves again, this time promising to enable artificial intelligence (AI) models with trillions of parameters to run faster and more efficiently than traditional ...