Motorola designed its 16-pin PFP-16 power flat package for RF power amplifiers and similar components. You can attach and solder this surface-mount package to the pc board using the same standard ...

With its differentiating chip-package-system EDA tools and mass-production proven filter IPs, Xpeedic RF EDA/Filter Design Platform accelerates the designs of highly integrated RF module and system.

Texas Instruments has turned to 45nm RF CMOS process to squeeze a 60GHz radar, including antenna, into an 11 x 6.7mm package only 0.8mm tall. IWRL6432AOP is an FMCW radar that works over 57 to 63.9GHz ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, ...

The advanced packaging market for 5G RF FEM is projected to reach US $2.3 billion by 2026, representing a 30% compound annual growth rate (CAGR) according to Yole Développement (Yole), SA, an ...

RF Transmitter This simple RF transmitter, consisting of a 434MHz license-exempt Transmitter module and an encoder IC , was designed to remotely switch simple appliances on and off. The RF part ...

Guerrilla RF, Inc. (OTCQX: GUER) announces that its high-efficiency GRF5509 4-watt power amplifier was selected by Impinj (NASDAQ: PI) for use in their enterprise-grade RAIN RFID reader module ...

We regard multichip module (MCM) BGA as an enabling technology that provides high-reliability, compact size, faster time to market and reduced costs for RF circuits. The use of chip capacitors and ...

Apple reportedly will continue developing its own mmWave AiP (antenna in package) modules for its next-generation iPhone lineup, with related efforts likely to push the US handset brand moving ...