The IS31FL3758 is available now in a compact 7×7mm QFN-60 package, with a thermal resistance (θ_JA) of 32.6°C/W, supporting a maximum power dissipation of approximately 3.07W at 25°C ambient ...

Kinetic Technologies, a leader in power management solutions, announces the launch of the KTB8375, a high-performance 6A synchronous buck regulator designed for industrial, telecom, networking, ...

Modern gaming laptops are in an uncomfortable spot – often too underpowered for newest titles, but too bulky to be genuinely portable. It doesn’t help they’re not often upgradeable, so you ...

Last year, we’ve featured a super cheap smart ring – BLE, accelerometer, heart sensor, and a battery, all in a tiny package that fits on your finger. Back when we covered it, we expected ...

From its origins in a garage to becoming one of the most recognisable symbols in the world, explore the story behind the iconic Apple logo design. Apple is a company that has changed the technology ...

The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. From a market segment perspective, MLF/QFN packaging solutions represent a >111B-unit market across five unique ...