In a highly competitive market, a plastic parts company leveraged Lean Six Sigma methodologies, particularly Process ...

Additionally, the automatic pattern classification groups all the wafers with the same pattern, which enables an advanced in-depth analysis and comparison. Process excursions can impact product wafer ...

Identifying issues that actually affect yield is becoming more critical and more difficult at advanced nodes, but there is progress. Although they are closely related, yield management and process ...

Onto Innovation ONTO recently introduced cutting-edge sub-surface inspection capability ... or thinning process, including micro cracks. These are likely to cause “die yield issues” and ...