For semiconductor manufacturers, supply chain reliability has escalated from an operational challenge to a boardroom-level ...

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap ...

Lip-Bu Tan on today’s earnings call: > I’m also instituting a policy. Every major chip design needs to be personally reviewed and approved by me before tape out. He says it’ll move Intel ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

The Fujifilm X-E5 is one of the best-looking cameras out there, with a rangefinder-style body, Film Simulation profiles, and dial-driven exposure control that will win over photo enthusiasts.

That’s a critical step toward scalable quantum systems.” Each chip hosts a dozen of these quantum light factories, all running in parallel without stepping on each other’s toes.

A Brand-New Chip from MediaTek The Redmi Turbo 5 is said to operate on a MediaTek Dimensity 8500 Ultra chip, though not yet announced.

If you've been waiting nearly a decade for the just-announced RX1R III, you're in for a severe case of sticker shock, as the ...

Why and where limitations are needed in AI-driven design, and where software-defined hardware works best.

Discover the Google Pixel 10 leaks: triple camera, Tensor G5 chip, and stunning design upgrades. Everything you need to know.

To tackle this challenge, a team from the Center for Optics, Photonics and Lasers (COPL) has come up with an optical chip that can transfer massive amounts of data at ultra-high speed.