Introduction Cardiovascular benefits deriving from physical activity are well known, but it is unclear whether physical activity trajectories in late life are associated with different risks of ...

Near-field mapping along the surface of an integrated circuit (IC) could reveal the radiated emission source inside by collecting the radiated electromagnetic field. In this article, the radiated ...

The Fast Cross-Platform Package Manager. Contribute to mamba-org/mamba development by creating an account on GitHub.

Warpage due to thermal stresses in IC packaging is a current challenge for the semiconductor manufacturing industry. This study uses FEM coupled with a direct optimization to reduce warpage in an AMB ...

Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...