Abstract: Chip-barrier/printed-wiring-board joints have been tested isothermally, at 35 degrees C, in shear. The joints were subjected to fully reversed cycling with ...

Abstract: Measurements of temperature histories of epoxy/glass prepreg layers during multilayer printed wiring board lamination have been recently obtained. It is shown that the temperature histories ...

We present a novel microfluidic device based on the integration of printed circuit boards and an isotachophoresis assay for sample preparation of nucleic acids from biological samples. The device has ...