Designed for AI and high-performance computing applications, the substrate offers excellent flatness and thermal stability, which help reduce warpage and heat generation under high-speed processing.

A prepreg combines a partially cured polymer matrix, such as epoxy or phenolic resins, with reinforcing fibers. Common fiber types include glass, carbon, and aramid, while basalt is a notable ...

Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling its move ...

This article presents a composite right-/left-handed (CRLH) loaded slow wave substrate integrated waveguide (SW-SIW) filter using through glass via (TGV) technology. The proposed glass-based topology ...

Download this Circuit Board Circuit Schematic And Circuitry Graphic Design Electronics Pcb Chip And Microcontroller Vector Design And Illustration vector illustration now. And search more of iStock's ...

According to rumors, Intel pivots its glass substrate strategy to rely on external partners after its 18A node failed to attract foundry clients.

Among advanced packaging technology for heterogeneous chips, die-embedded packaging technology is expected for the minimization of packaging substrate thickness through integration of a large device ...