SAN FRANCISCO--(BUSINESS WIRE)--Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle™ interconnect ... mm shoreline density and extends ultra-high density die ...

SAMTEC Si-Fly HD co-packaged and near-chip systems provide high ... an optical cable assembly of your choosing. Co-packaged CPX offers the lowest loss signal transmission from the package to the front ...

Nubis Communications, a leader in high-density optical interconnect solutions for AI networks, and Samtec, the service leader in the connector industry, will exhibit their joint copper and optical ...

At next month’s Optical Fiber Communication Conference ... technologies in support of chip-to-chip, chip-to-module, backplane, copper cable, and single-mode fiber technologies to facilitate ...

LISLE, Ill., March 25, 2025 /PRNewswire/ -- Molex, a global electronics leader and connectivity innovator, today unveils its VersaBeam Expanded Beam Optical (EBO) Interconnect Solutions, an innovative ...

Licensing agreement combines advanced optical innovations from 3M with US Conec's expertise in high-density connectivity ... for 3M™ Expanded Beam Optical Interconnect technology, a solution ...

Licensing agreement combines advanced optical innovations ... Conec's expertise in high-density connectivity solutions for next-generation networks 3M Expanded Beam Optical Interconnect is a ...

Ribbon Communications announced that Diabolocom has selected Ribbon’s high density Data Center Interconnect (DCI ... the industry’s highest density and lowest power consumption optical transport DCI.

enterprises and critical infrastructure operators modernize and protect their networks with its state-of-the-art real time communications technology and IP optical networking solutions, announced that ...

The company’s optical interconnect layer allows hundreds ... Once you leave the rack, you go from high-density interconnect to basically a cup on a string,” Nick Harris, CEO and founder ...

Addressing this chip-level issue, Avicena announced its scalable LightBundle chiplet interconnect solution. It offers ultra-high-density die-to-die connections with a multi-Tb/s/mm shoreline ...