Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced ...
At Semicon West, Applied Materials unveiled three semiconductor manufacturing systems that it said targeted specific ...
Tom's Hardware on MSN
Applied Materials preps for 'Angstrom Era' in chipmaking — spearheaded by its new Kinex, Xtera, and PROVision 10 systems
Applied Materials has introduced three new chipmaking systems that are set to mark the beginning of the 'angstrom' and 3D ...
Applied Materials has introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI computing.
WD_Black SN8100 review: a fast, consistent PCIe Gen5 SSD that outpaces Gen4 rivals and challenges Crucial’s T705 across real workloads ...
U.S. shares of Taiwan Semiconductor Manufacturing Co. outpaced the broader chip sector Monday following a report that increased AI-related orders from Nvidia Corp. have allowed the third-party ...
You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.
Abstract: 3D NAND technology is expected to continue advancing toward 1000-layer stacking in pursuit of ever-higher memory density per chip [1]. However, increasing the number of layers presents ...
Abstract: We perform a comprehensive study of memory retention characteristics in ferroelectric field-effect transistors with different engineered gate stacks designed to achieve a large memory window ...
There was an error while loading. Please reload this page. This repository contains transistor-level simulations of NMOS, PMOS, 2:1 Multiplexers, and an XOR gate ...
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