With the advancement of the chip industry, manufacturing processes have become increasingly sophisticated, resulting in a significant rise in the scale and complexity of integrated circuits. This ...

A next generation system and methodology for high-throughput e-beam hot spot inspection.

Hybrid bonding is being evaluated for advanced packaging of 2.5 and 3D modules due to the enhanced scalability and performance (thermal, electrical and reliability) of the interconnect. The direct ...

Recent supply chain rumors have indicated that TSMC will withdraw from the gallium nitride (GaN) market, a third-generation semiconductor material, with related production lines at its Hsinchu ...

Using only a single-crystal piezoelectric thin wafer of lithium niobate (LN) instead of the usual two-part structure, a group from Nagoya University in Japan has created a deformable mirror that ...