With the advancement of the chip industry, manufacturing processes have become increasingly sophisticated, resulting in a significant rise in the scale and complexity of integrated circuits. This ...

Hybrid bonding is being evaluated for advanced packaging of 2.5 and 3D modules due to the enhanced scalability and performance (thermal, electrical and reliability) of the interconnect. The direct ...

Using only a single-crystal piezoelectric thin wafer of lithium niobate (LN) instead of the usual two-part structure, a group from Nagoya University in Japan has created a deformable mirror that ...

The interest in the wafer-scale growth of two-dimensional (2D) materials, including transition metal dichalcogenides (TMDCs), has been rising for transitioning from lab-scale devices to ...