Currently, only three companies (Micron, SK Hynix, and Samsung) possess the complex fab capability to produce ... HBM requires roughly three times the wafer area per bit of regular DDR, which ...

According to HCL Group Chairperson Roshni Nadar Malhotra, the project will combine “HCL’s engineering DNA” with “Foxconn’s semiconductor capabilities” to support sectors such as consumer electronics, ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...

Micron’s growth in capacity for 2019 was boosted by the opening of a new 300mm wafer fab at its site in Singapore. The company also acquired Intel’s share of their IM Flash joint-venture fab in Lehi, ...

ASML’s new $400 million chip colossus transforms how semiconductors are made. CNBC got the first-ever on-camera look at the ...

†About Tower Semiconductor Ltd. Tower Semiconductor Ltd. is a pure-play independent wafer foundry established ... maintains two manufacturing facilities: Fab 1 has process technologies from 1.0 to 0 ...

Making the announcement, Union minister for electronics and information technology Ashwini Vaishnaw, said the plant will ...

The Rs 3,706 crore HCL-Foxconn OSAT joint venture, approved by the Cabinet, will set up a semiconductor packaging facility in Jewar, Uttar Pradesh, to produce display driver chips. As India’s sixth ...

The fourth and final fabrication plant, or fab, would be done in 2041, according to an environmental impact report Micron recently submitted to the federal and county governments. Syracuse.com has ...

Ontario-based VueReal, the developer of MicroSolid Printing technology, has announced a partnership with ACA TMetrix, a ...