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Abstract: Whisker formation is generally recognized to be a stress relief mechanism common to electrodeposited films of tin (Sn), cadmium (Cd), zinc (Zn), and silver (Ag). This paper constructs a ...

A finite element‐based constrained mixture implementation for arterial growth, remodeling, and adaptation: Theory and numerical verification A. Valentín, J.D. Humphrey and G.A. Holzapfel 24 May 2013 | ...