Intel says that its two High-NA EUV lithography machines are in use and are an improvement over the OG EUV equipment.

TSMC has announced a US$100 billion investment in the US, including three wafer fabs, two packaging facilities, and an R&D ...

While Intel could potentially become a stronger competitor, we believe its ability to transition from 7nm to 2nm by 2025 will depend on its execution strategy. TSMC’s CoWoS (Chip-on-Wafer-on ...

Power savings - Micron's 1γ node, using next-generation high-K metal gate CMOS technology paired with design optimizations, enables greater than 20% lower power, which leads to improved thermal ...

Leading-edge AI chips from Nvidia, AMD, and Intel already depend on EUV-fabricated 5nm and 3nm ... and resist chemistry forward to increase yield and drive down per-wafer costs. Imec has played a ...

Companies such as TSMC, Intel, IBM Research and Samsung are working on integration ... What it comes down to is a 10nm wide line may only include around 4nm- to 5nm-wide copper once the TaN barrier ...

Intel has now embraced a permanent multi-foundry approach, outsourcing approximately 30 percent of its wafer production to TSMC. According to Intel's VP of Investor Relations, John Pitzer ...

Back in 2021, Intel Corp’s former CEO Pat Gelsinger started the make-Intel-great-again project, called IDM 2.0, to reposition the company as an advanced and efficient wafer fabrication service ...

Intel stock has experienced significant volatility ... On top of that, INTC is still fighting its production problem of 10nm and 7nm which allowed AMD, which uses TSMC's production, to overtake ...

Arguably, you might conclude that about 5N4Y in general. Looking at each of the nodes in turn, Intel 7 is a version of the same 10nm technology that Intel had been struggling with for a decade ...