The news comes after company leaders said they were planning reductions amid an organization-wide overhaul prompted by a flagging performance.

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

The law enables Intel to save big while expanding its manufacturing ... of Commerce under the U.S. CHIPS and Science Act to advance critical semiconductor manufacturing and advanced packaging projects ...

Currency risk is limited as most transactions are made in USD. Intellectual property theft is a major risk. The most high-profile incident was TSMC’s settlement with SMIC, in which the firm received ...

Here are report cards for all 32 NHL teams, based on the moves made through Monday. These are based on the moves they made, ...

The growing need for sustainable packaging in the CPG industry Sustainability is now at the forefront of the modern packaging landscape.

SK keyfoundry, an 8-inch pure-play foundry in Korea, has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor ...

Trump admin faces multi-front pushback on reported plans to cut most of DHS intel bureau memoriesarecaptured/Getty Images By David DiMolfetta July 3, 2025 ...

Pricing for Intel's new Xeon 6900P processor family has been announced, and it's steep, making it the most expensive x86 CPU available today ...

Plan to slash DHS intel office faces multi-front pushback Jewish-community and law enforcement organizations have asked Trump administration security chiefs to preserve the DHS Office of ...

Simply using your food packaging in the manner it's supposed to be used is enough to contaminate your comestibles with a sprinkling of microplastics.