He ended with a sentiment that applies to everyone we've met from Intel while researching this article: "I truly believe this is the most fun time and the exciting time to be in packaging.

On 27 November, the US Department of Commerce finalised $7.86bn in direct funding to domestic chip maker, Intel, to advance its semiconductor ... and advanced packaging capacity in the US.

Despite rumors of reduced orders for advanced packaging capacities, Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up its advanced packaging capacity to meet the growing demand for ...

Intel CEO Pat Gelsinger says the deal will advance its plan to manufacture chips for other companies by expanding its fab capacity and giving the semiconductor giant access to Tower’s specialty ...